Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
-15%
portes grátis
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Seok, Seonho
Springer International Publishing AG
05/2018
115
Dura
Inglês
9783319778716
15 a 20 dias
454
Descrição não disponível.
Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
Polymer Packaging cap;Transfer packaging;MEMS packaging;Surface modification;Wafer-level
Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
